Wafer can refer to: Wafer (cooking) - Edible wafers, such as thin biscuits, cookies or cakes Wafer (electronics) - semiconductor wafers Other related archivesWafer (cooking), Wafer (electronics)

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In microelectronics, a wafer is a thin slice of semiconducting material, such as a silicon crystal, upon which microcircuits are constructed by doping (for example, diffusion or ion implantation), etching, and deposition of various materials. Wafers are thus of key importance in the fabrication of semiconductor devices such as integrated circuits. They are made in various sizes ranging from 1 inch (25.4 mm) to 11.8 inches (300 mm), and thi ...

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• Wafer electronics - Sources

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Aptosticus Myrmekiaphila Promyrmekiaphila The wafer trapdoor spiders (family Cyrtaucheniidae) are a widespread family of spider that lacks the thorn-like spines on tarsi and metatarsi I and II (the two outermost leg segments) found in true trapdoor spiders (Ctenizidae). Many, but not all, make wafer-like doors to their burrows, while others build the cork-like doors found commonly in the true trapdoor spiders. The family is well represented in the United States, Mexico, South America, and Africa. ...

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An ASIC (application-specific integrated circuit) is an integrated circuit (IC) customised for a particular use, rather than intended for general-purpose use. For example, a chip designed solely to run a cell phone is an ASIC. In contrast, the 7400 series integrated circuits are logic building blocks that can be wired together to perform many different applications. As feature sizes have shrunk and design tools improved over the years, the maximum complexity (and hence functionality) possible in an ASIC has grown from 5, ...

Including:

• Application-specific integrated circuit - History
• Application-specific integrated circuit - Standard Cell ASIC Design
• Application-specific integrated circuit - Semi-Custom ASIC Design
• Application-specific integrated circuit - Full-Custom ASIC Design
• Application-specific integrated circuit - Structured/Platform ASIC Design
• Application-specific integrated circuit - Cell Libraries IP-Based Design Hard and Soft Macros
• Application-specific integrated circuit - Multi-Project Wafers

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Chemical-mechanical planarization or Chemical-mechanical polishing, commonly abbreviated CMP, is a technique used in semiconductor fabrication for planarizing the top surface of an in-process semiconductor wafer or other substrate. The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retai ...

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Wet etching is the removal of material by immersing the wafer in a liquid bath of chemical etchant. There are two kinds of wet etching etchants, isotropic etchants and anisotropic etchants: Isotropic etchants attack the material being etched at the same rate in all directions. Anisotropic etchants attack the silicon wafer at different rates in different directions. On wafers the most used etchant is KOH. Anisotropic etching does not cause undercutting, and is preffered in app ...

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A boule is a term used to describe a single crystal ingot produced by synthetic means. In the semiconductor industry they can be made by a number of methods, such as the Bridgeman technique, or Czochralski process. A cylindrical rod is produced. A semiconductor crystal boule is normally cut into circular wafers. Each wafer is polished to give substrates suitable for semiconductor devices to be fabricated on. Other related archivesBridgeman technique, Czochralski process, ingot, semicon

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The Blessed Sacrament is a devotional name used by Roman Catholics to refer to a consecrated host, that is, a communion wafer which Catholics believe has actually become the body and blood of Jesus at the moment of the Consecration during the Liturgy of the Eucharist at Mass. The Blessed Sacrament may be received by Catholics who have undergone their First Holy Communion (ie., given by a priest or other Minister of the Eucharist to a Catholic and swallowed by the communicant) as part of the Liturgy of th ...

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Wet could refer to: The condition of being liquid. Western European Time (WET). The wets, moderate members of the British Conservative Party. Phencyclidine (PCP), a dissociative anesthetic. The Wuest Expanded Translation (WET) of the New Testament. Wet, a magazine about "gourmet bathing" from the late 1970s. See also. Wetting, getting two different materials to adhere (stick) to each other. Wet Wet Wet, successful ...

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A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 12" (300 mm) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75mm thick and polished to obtain a very regular and flat surface. Once the wafers are prepared, many process steps are necessary to produce the desired semiconductor integrated circuit. In general the steps can be grouped into four areas: Front end processing Back end ...

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Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer test and device test, Semiconductor fabrication - List of steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Wafers

A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 12" (300 mm) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75mm thick and polished to obtain a very regular and flat surface. In 2005, a typical cost for a processed 300mm wafer was about $US 300,000. The desire for profit ins ...

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Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer Test, Semiconductor fabrication - Device Test, Semiconductor fabrication - List of Steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Wafers

Once the Back End Processing has been completed, the semiconductor devices are subjected to a variety of electrical tests to determine if they function properly. The proportion of devices on the wafer found to perform properly is referred to as the yield. Finally, the wafer is cut into individual dice, which are then packaged in ceramic or plastic packages with pins or other connectors to the outside world. The packaged chips are then retested to ensure that they were not damaged during packaging ...

See also:

Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer test and device test, Semiconductor fabrication - List of steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Wafer test and device test

Once the Back End Processing has been completed, the semiconductor devices are subjected to a variety of electrical tests to determine if they function properly. The proportion of devices on the wafer found to perform properly is referred to as the yield. The fab tests the chips on the wafer with an electronic tester that presses tiny probes against the chip. The machine marks the bad chips with a drop of dye. The fab charges for test time. Chips are often designed with “testabi ...

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Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer Test, Semiconductor fabrication - Device Test, Semiconductor fabrication - List of Steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Device Test

Front End Processing refers to the most crucial steps in the fabrication. In this stage the actual devices, including transistors and resistors are created. A typical front end process includes the following: preparation of the wafer surface, growth of silicon dioxide (SiO2), patterning and subsequent implantation or diffusion of dopants to obtain the desired electrical properties, growth or deposition of a gate dielectric, and growth or deposition ...

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Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer test and device test, Semiconductor fabrication - List of steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Processing

When feature widths were far greater than about 10 micrometres, purity was not the issue that it is today in device manufacture. But as the devices became more integrated the cleanrooms became even cleaner. Today, the facilities, known as fabs, are pressurized with filtered air, to remove even the smallest particles which could come to rest on the wafers and contribute to defects. The workers in a semiconductor fabrication facility are required to wear cleanroom s ...

See also:

Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer test and device test, Semiconductor fabrication - List of steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - History

(Karlleeser 07:12, 30 January 2006 (UTC)) In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties. Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer. Available technologies consist of physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) a ...

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Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer Test, Semiconductor fabrication - Device Test, Semiconductor fabrication - List of Steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Processing

When feature widths were far greater than about 10 micrometres, purity was not the issue that it is today in device manufacture. But as the devices became more integrated the cleanrooms became even cleaner. Today, the facilities, known as fabs, are pressurized with filtered air, to remove even the smallest particles which could come to rest on the wafers and contribute to defects. The workers in a semiconductor fabrication facility are required to wear cleanroom s ...

See also:

Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer Test, Semiconductor fabrication - Device Test, Semiconductor fabrication - List of Steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - History

Many toxic materials are used in the fabrication process. These include: poisonous elemental dopants such as arsenic, boron, antimony and phosphorus poisonous compounds like arsine, phosphine and silane highly reactive liquids, such as hydrogen peroxide, fuming nitric acid, sulfuric acid and hydrofluoric acid It is vital that workers are not directly exposed to these dangerous substances. The high degree of automation common in the IC fa ...

See also:

Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer test and device test, Semiconductor fabrication - List of steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Hazardous materials note

Many toxic materials are used in the fabrication process. These include: poisonous elemental dopants such as arsenic, boron, antimony and phosphorus poisonous compounds like arsine, phosphine and silane highly reactive liquids, such as hydrogen peroxide, fuming nitric acid, sulfuric acid and hydrofluoric acid It is vital that workers not be directly exposed to these dangerous substances. The high degree of automation common in the IC fa ...

See also:

Semiconductor fabrication, Semiconductor fabrication - Wafers, Semiconductor fabrication - Processing, Semiconductor fabrication - Wafer Test, Semiconductor fabrication - Device Test, Semiconductor fabrication - List of Steps, Semiconductor fabrication - Hazardous materials note, Semiconductor fabrication - History

Read more here: » Semiconductor fabrication: Encyclopedia II - Semiconductor fabrication - Hazardous materials note