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Printed circuit board - Surface-mount technology | | Printed circuit board - Surface-mount technology: Encyclopedia II - Printed circuit board - Surface-mount technology | | Surface-mount technology was developed in the 1960s and became widely used in the late 1980s. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of the board became far more common with surface-mounting than through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates. SMDs can be one-quarter to one-tenth the size and w ...
See also:Printed circuit board, Printed circuit board - General characteristics, Printed circuit board - History, Printed circuit board - Design, Printed circuit board - Substrates, Printed circuit board - Manufacture and population of conventional PCBs, Printed circuit board - Protection and packaging, Printed circuit board - 'Cordwood' construction, Printed circuit board - Surface-mount technology | | | Printed circuit board, Printed circuit board - 'Cordwood' construction, Printed circuit board - Design, Printed circuit board - General characteristics, Printed circuit board - History, Printed circuit board - Manufacture and population of conventional PCBs, Printed circuit board - Protection and packaging, Printed circuit board - Substrates, Printed circuit board - Surface-mount technology, Breadboard, EDA, E-waste, gEDA -- GPL'ed PCB design software suite with an active user community and knowledgebase., OrCAD -- Commercial electronic PCB capture design software., TARGET 3001! -- Commercial electronic PCB design software., Conductor Current Capacity | | |
| | | Printed circuit board: Encyclopedia II - Printed circuit board - Surface-mount technology
Printed circuit board - Surface-mount technology
Surface-mount technology was developed in the 1960s and became widely used in the late 1980s. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of the board became far more common with surface-mounting than through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates. SMDs can be one-quarter to one-tenth the size and weight, and one-half to one-quarter the cost of through-hole parts.
For more details, see the article surface-mount technology.
Other related archives1936, 1943, 1948, 1960s, 1980s, Austrian, Breadboard, Conductor Current Capacity, DuPont, E-waste, EDA, EU, Edge connectors, Excellon files, FR-2, FR-4, Gerber, HPGL, Kapton, OrCAD, PCB Milling, PCB layout guidelines, Paul Eisler, Pertinax, Photoengraving, RF, ROHS, Silk screen printing, Surface-mount technology, TARGET 3001!, Teflon, World War II, cameras, components, conductors, convection, cooling, designs the circuit, dielectric constant, electronic, electroplating, epoxy resin, etching, fiberglass, flex circuits, gEDA, glass fiber, gold plated, hearing aids, hybrid circuits, inkjet, insulator, laminated, lasers, nickel, permittivity, phenolic resin, photoplotter, plotter, point-to-point constructed, point-to-point construction, polyimide, polystyrene, radio, radio frequency, solder, soldering, substrate, surface mount, surface-mount technology, tungsten carbide, vacuum, vias, wave-soldering, wax, wire wrap, wire-wrapped, zero gravity
 Adapted from the Wikipedia article "Surface-mount technology", under the G.N U Free Docmentation License. Please also see http://en.wikipedia.org/wiki |
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